| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which solves a problem occurring when a drawn hole is covered with an encapsulation resin that the coated resin produces a projection from a package outer shape thereby to cause an increase in outline dimension of the semiconductor device.SOLUTION: In a semiconductor device of the present embodiment, a resin encapsulation body and a drawn hole are covered with an encapsulation resin and the resin encapsulation body includes a resin recess and the draw hole is located inside the resin recess of the resin encapsulation body. An internal surface of the resin recess forms a mirror surface.SELECTED DRAWING: Figure 1 |
