发明名称 |
MEMS DEVICE AND MEMS DEVICE MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a MEMS device and a MEMS device manufacturing method, which can prevent deformation or breakage of a substrate side due to thermal expansion and shrinkage of a through electrode.SOLUTION: A MEMS device 100 includes an element part 120 which is provided on a substrate 110 and has a movable part 121; a joining part 150 which is provided on the substrate 110 to surround the element part 120; and a lid part 160 with a part of a substrate side surface 160a being joined to the joining part 150 to form an internal space 170 including the element part 120. The lid part has a through electrode which pierces the lid part, and a connection electrode which is formed on the substrate side surface at a portion joined to the joining part and which is electrically connected with the through electrode. The joining part has a space for exposing a part of the connection electrode at a portion overlapping the through electrode in plan view.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016072339(A) |
申请公布日期 |
2016.05.09 |
申请号 |
JP20140198163 |
申请日期 |
2014.09.29 |
申请人 |
NIPPON DEMPA KOGYO CO LTD |
发明人 |
IWAI HISASHI;NAKAMURA MAKIKO |
分类号 |
H01L23/02;B81B3/00;B81C3/00;H03H3/007;H03H9/24 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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