ADHESIVE TAPE FOR ELECTRONIC COMPONENT

摘要

The present invention relates to an adhesive tape for an electronic component, in which a heat resistant base layer, a primer coating layer formed by hardening a coating liquid containing an epoxy silane coupling agent on the heat resistant base layer, and an adhesive layer are produced in a lamination type. The adhesive tape for an electronic component according to the present invention has excellent cohesion provided between the heat resistant base layer and the adhesive layer by means of the primer coating layer. Accordingly, after detaping is performed due to a plasma process during an electronic component producing procedure, adhesive residue is prevented, and a leakage of a sealed resin and staining may be alleviated. By means of the adhesive layer, adhesive strength is not ensured at the room temperature but is expressed only during a heating lamination process, thereby ensuring excellent sticking properties and adhering properties with respect to a lead frame and helping to improve reliability during the production of a semiconductor device. Also, a leakage of an envelope material is prevented and a fault in outer appearance of a product may be prevented when the adhesive tape is removed after the heating lamination process is finished.