CURING CATALYST, EPOXY RESIN COMPOSITION COMPRISING THE SAME FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PREPARED FROM USING THE SAME

摘要

The present invention relates to a curing catalyst represented by chemical formula 1. The present invention further relates to an epoxy resin composition for sealing semiconductor devices including the same, and to a semiconductor device sealed by using the same. More specifically, the purpose of the present invention is to provide a curing catalyst capable of catalyzing epoxy resin cure even at a low temperature due to a low curing initiation temperature.