| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing method and a substrate processing apparatus, which perform suck back to make a processing liquid remaining in a processing liquid supply pipe or a processing liquid nozzle become an intended quantity.SOLUTION: In a substrate processing apparatus, suck back from a processing liquid supply pipe and a processing liquid nozzle is performed by performing a suction process by a control unit. The suction process includes: (a) a process of starting an operation of sucking means; (b) a process of specifying a moving time of a processing liquid tip surface moving time; (c) a process of reading out relationship data from a storage unit; (d) a process of calculating sucking stop timing based on the processing liquid tip surface moving time and the relationship data; and (e) a process of stopping an operation of sucking means at the sucking stop timing. Regardless of a difference in processing liquid tip surface moving time, it is possible to suck back the processing liquid to an intended position.SELECTED DRAWING: Figure 1 |
