发明名称 HOLDING METHOD FOR WAFER
摘要 PROBLEM TO BE SOLVED: To hold a wafer while positioning a center of the wafer on a rotation axis of a spinner table.SOLUTION: A holding method for a wafer includes: an initial holding step of holding a wafer W by moving three rotary members 110 in a radial direction toward the center of the wafer W and bringing clamp parts 110a of the rotary members 110 into contact with an outer circumferential part Wc of the wafer W; and a holding step of holding the wafer W by moving the clamp parts 110a towards an outer circumferential side of the wafer W a little in the state where the wafer W is held by the clamp parts 110a, releasing a force that is applied in a radial direction of the wafer W, moving the clap parts 110a in the radial direction toward the center of the wafer W and bringing the clamp parts 110a of the rotary members 110 into contact with the outer circumferential part Wc of the wafer. Thus, the wafer W can be reliably held while positioning the center of the wafer W in a center of a rotation axis 6 of a spinner table 4.SELECTED DRAWING: Figure 3
申请公布号 JP2016072428(A) 申请公布日期 2016.05.09
申请号 JP20140200252 申请日期 2014.09.30
申请人 DISCO ABRASIVE SYST LTD 发明人 KUBO TETSUO;KOSHIOKA YUJI;ITO TAICHI
分类号 H01L21/68;H01L21/683 主分类号 H01L21/68
代理机构 代理人
主权项
地址