| 摘要 |
PROBLEM TO BE SOLVED: To provide a package which is capable of ensuring airtightness reliability and can also respond to a requirement for downsizing, by being formed in a meniscus shape capable of improving a brazing bond strength and by preventing a metallized film from being exfoliated from an insulation substrate even if a stress is concentrated in a corner.SOLUTION: The package includes: a ceramic substrate 11 or an insulation substrate 13 including a notch 12 in a corner of a conjugate of the ceramic substrate and a ceramic frame body 26; a metallized film 15 in a belt-shaped pattern in an outer circumferential part of a top face of the substrate; and a metal frame body 16 on a top face of the metallized film. An outer circumferential side shape 20 of the band-shaped pattern includes: an outer circumferential side shape 20 as large as the size of connecting a straight line part 18 proximate to an upper edge of a side part of the insulation substrate 13 and a curved line part 19 that is curved along an upper edge of the notch 12 and larger than an outer circumferential side of the metal frame body 16; and an inner circumferential side shape 21 substantially as large as or smaller than the size of an inner circumferential side. The metal frame body 16 has an outer circumferential radius 22 that is larger than a radius of the notch 12, and an inner circumferential radius 23 that is as large as or smaller than the outer circumferential radius.SELECTED DRAWING: Figure 1 |
