| 摘要 |
PROBLEM TO BE SOLVED: To provide an ingot cutting method capable of cutting a less warped wafer without deteriorating the occurrence rate of wire cutting.SOLUTION: During cutting of the maximum-diameter part of an ingot, a tensile force applied to the wire of a side delivered from a bobbin is set as a reference tensile force, the ingot cutting method carries out cutting of the ingot by setting a tensile force applied to the wire of the side delivered from the bobbin when the cutting start part of the ingot is cut higher than the reference tensile force, and setting a tensile force applied to the wire of a side wound on the bobbin lower than the reference tensile force.SELECTED DRAWING: Figure 1 |
