发明名称 SOLDER INSPECTION EQUIPMENT AND METHOD
摘要 PURPOSE: To determine an accurate quality of solder, utilizing a phenomenon that satisfactory solder is raised to have a certain height, so that a light-dark ratio of the satisfactory solder is drastically different from that of low and flat defective solder when vertically illuminated.CONSTITUTION: A luminaire 22 irradiates a substrate surface with vertical light and an imaging apparatus 25 captures an image of an area including a solder part from directly above. An image of the solder part is extracted from the image captured by the imaging apparatus, and a dark area ratio in the extracted image of the solder part is obtained. The obtained dark area ratio is compared with a predetermined threshold value to determine the quality of solder.SELECTED DRAWING: Figure 6
申请公布号 JP2016070723(A) 申请公布日期 2016.05.09
申请号 JP20140198017 申请日期 2014.09.29
申请人 DAINIPPON PRINTING CO LTD 发明人 OKAZAWA ATSUSHI;KOIZUMI HAYAHIKO;MIYAMOTO YUJI
分类号 G01N21/956;G01B11/28;G06T1/00;H05K3/34 主分类号 G01N21/956
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