发明名称 |
SOLDER INSPECTION EQUIPMENT AND METHOD |
摘要 |
PURPOSE: To determine an accurate quality of solder, utilizing a phenomenon that satisfactory solder is raised to have a certain height, so that a light-dark ratio of the satisfactory solder is drastically different from that of low and flat defective solder when vertically illuminated.CONSTITUTION: A luminaire 22 irradiates a substrate surface with vertical light and an imaging apparatus 25 captures an image of an area including a solder part from directly above. An image of the solder part is extracted from the image captured by the imaging apparatus, and a dark area ratio in the extracted image of the solder part is obtained. The obtained dark area ratio is compared with a predetermined threshold value to determine the quality of solder.SELECTED DRAWING: Figure 6 |
申请公布号 |
JP2016070723(A) |
申请公布日期 |
2016.05.09 |
申请号 |
JP20140198017 |
申请日期 |
2014.09.29 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
OKAZAWA ATSUSHI;KOIZUMI HAYAHIKO;MIYAMOTO YUJI |
分类号 |
G01N21/956;G01B11/28;G06T1/00;H05K3/34 |
主分类号 |
G01N21/956 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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