发明名称 ETCHING SYSTEM AND ETCHING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an etching system and an etching method which allow for long life of the devices and facility, and sustainability of etching quality, while suppressing consumption of the etchant.SOLUTION: An etching system 10 includes an etching section 142, an etchant supply section 144, a liquid mixing section 12, and a hydrofluoric acid regeneration device 18. The liquid mixing section 12 is connected with the etchant supply section 144, and is configured so that an etchant can be produced by mixing more than one kinds of liquid containing at least hydrofluoric acid. The hydrofluoric acid regeneration device 18 is configured to regenerate the hydrofluoric acid by using the reaction products of etching, and to supply the regenerated hydrofluoric acid to the liquid mixing section 12. The etchant of amount corresponding to the supply amount from the liquid mixing section 12 to the etchant supply section 144 is supplied from the etchant supply section 144 to the hydrofluoric acid regeneration device 18.SELECTED DRAWING: Figure 1
申请公布号 JP2016072440(A) 申请公布日期 2016.05.09
申请号 JP20140200656 申请日期 2014.09.30
申请人 NSC:KK 发明人 YAMAZAKI MASARU;FUJIWARA TAKESHI;SAKURAI KENICHI;SHIMIZU YUTO;OGURA YO;FUKAYA YASUSHI;IMAOKA TAKAYUKI;SAI SHUNSUKE;NAKAJIMA TAKAHITO
分类号 H01L21/306 主分类号 H01L21/306
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