| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can inhibit warpage of a ceramic substrate.SOLUTION: A semiconductor device comprises a semiconductor element 4 and a ceramic circuit board 10 on which the semiconductor element is mounted. The ceramic circuit board 10 includes: a ceramic substrate 11 having one surface and another surface which are opposite to each other; a metal circuit board 12 which is joined to the one surface of the ceramic substrate 11 and electrically connected to the semiconductor element; and a metal heat sink 13 joined to the other surface of the ceramic substrate 11. A thickness of the metal circuit board 12 is larger than a thickness of the metal heat sink 13. A surface area of a surface of the metal heat sink 13 on the side opposite to the ceramic substrate 11 is larger than a surface area of a surface of the metal circuit board 12 on the side opposite to the ceramic substrate 11.SELECTED DRAWING: Figure 3 |
