发明名称 PACKAGING MATERIAL FOR MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a packaging material for molding which has a protective coating layer having excellent moldability, chemical resistance, solvent resistance, and scratch resistance.SOLUTION: A packaging material 1 for molding includes an outer substrate layer 13 made of a heat-resistant resin, an inner sealant layer 16 made of a thermoplastic resin, a metal foil layer 11 arranged between the outer substrate layer 13 and the inner sealant layer 16, and a protective coating layer 14 formed on the side opposite to the metal foil layer 11 side of the outer substrate layer 13. The protective coating layer 14 is made of a resin composition containing a main agent resin, which contains a phenoxy resin and an urethane resin, and a curing agent and has a thickness of 0.1-10 μm.SELECTED DRAWING: Figure 1
申请公布号 JP2016068391(A) 申请公布日期 2016.05.09
申请号 JP20140200099 申请日期 2014.09.30
申请人 SHOWA DENKO PACKAGING CO LTD 发明人 WANG HONGLIN;NANBORI YUJI
分类号 B32B15/08;B65D65/40;H01M2/02 主分类号 B32B15/08
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