发明名称 HEAT RADIATION MODULE
摘要 PROBLEM TO BE SOLVED: To provide a heat radiation module having excellent heat radiation efficiency.SOLUTION: A heat radiation module 100 includes a hollow housing 110, a plurality of heat radiation fins 120 and heat radiating liquid 130. The hollow housing 110 includes a chamber 112, a side face 114, an upper surface 116, and an under surface 118 opposed to the upper surface 116. The side face 114 is connected to the upper surface 116 and the under surface 118. The heat radiation fins 120 are arranged on the side face 114. The heat radiating liquid 130 is contained in the chamber 112 and specific heat of the heat radiating liquid 130 is substantially 1 cal/g°C and more.SELECTED DRAWING: Figure 1
申请公布号 JP2016072604(A) 申请公布日期 2016.05.09
申请号 JP20150096726 申请日期 2015.05.11
申请人 SUBTRON TECHNOLOGY CO LTD 发明人 CHEN CHING-SHENG
分类号 H05K7/20;H01L23/427;H01L23/473 主分类号 H05K7/20
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