| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser processing device capable of efficiently performing abrasion processing.SOLUTION: Laser beam irradiation means includes: a pulse laser beam oscillator 51 which oscillates pulse laser beams; a beam collector 53 which collects the laser beams and irradiates an object to be processed held by object to be processed holding means; and beam axis oscillation means 54 which is arranged between the pulse laser beam oscillator 51 and the beam collector 53, oscillates a beam axis of a pulse laser beam oscillated from the pulse laser beam oscillator 51 and guides the pulse laser beams to the beam collector 53. Therein, the beam axis oscillation means 54 is constituted with a polygon scanner 58 which scans oscillated pulse laser beams and guides the beams to the beam collector 53 and acoustic optical deflection means which guides the beams to the polygon scanner 58, and oscillates the beam axis of the pulse laser beam compositely by a direction change of the beam axis by means of the acoustic optical deflection means and the direction change of the optical axis by means of the polygon scanner 58 and irradiates the object to be processed held by the object to be processed holding means.SELECTED DRAWING: Figure 2 |
