BREAKING METHOD AND BREAKING DEVICE FOR PATTERNING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a breaking method and a breaking device for a patterning substrate that use an expand system causing neither non-separation nor substrate damage.SOLUTION: There are provided a breaking method and a breaking device for a patterning substrate having an electric circuit pattern formed on a surface of a brittle material substrate, the method comprising: a laser processing process (laser processing device A) of sticking a patterning substrate W on an expand tape 2 and irradiating a surface of the patterning substrate W with laser light to form a plurality of parting-starting points 5 along lines of planned separation L; a specified place breaking process (specified place breaking device B) of determining, as specified places, defectively formed parts of parting-starting points 5 which are to be formed in the laser processing process, and making the patterning substrate W flex by applying external force to the specified places to break the patterning substrate; and an expand breaking process (expand breaking device C) of extending the expand tape 2 to load the patterning substrate W with tensile stress and parting all lines of planned separation L.SELECTED DRAWING: Figure 6