| 摘要 |
PROBLEM TO BE SOLVED: To cool a heating element, such as a semiconductor module having pin fins, while preventing breakdown.SOLUTION: A cooling structure of a heating element includes a heating element (600) having at least one cooling surface from which a plurality of pin fins are projecting, a heat-receiving plate (631A) having a shape along the cooling surface where a hole 633A, into which each pin fin is inserted idly, is formed at a position facing each pin fin, a cooler having a pair of clamping members for clamping the heating element and heat-receiving plate while pressing, and cooling the heat-receiving plate, and space securing units (632A, 632B) provided in the heat-receiving plate, and suppressing the interval of the pair of clamping members so that the pressing force by the clamping members is not applied to the heating element.SELECTED DRAWING: Figure 7 |
