| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability of a semiconductor device.SOLUTION: A semiconductor device comprises semiconductor chips CP1, CP2, a plurality of leads, a plurality of wires and an encapsulation part for encapsulating the semiconductor chips, the leads and the wires. The semiconductor chip CP1 has pad electrodes P1a, P1b and internal wiring NH for electrically connecting the pad electrodes P1a, P1b. A pad electrode P2a of the semiconductor chip CP2 and the pad electrode P1a of the semiconductor chip CP1 are electrically connected via a wire BW1. The pad electrode P1b of the semiconductor chip CP1 is electrically connected with a lead LD1 via a wire BW2. A distance between the lead LD1 and the semiconductor chip CP1 is smaller than a distance between the lead LD1 and the semiconductor chip CP2. And the pad electrodes P1a, P1b and the internal wiring NH are not electrically connected to any circuit formed in the semiconductor chip CP1.SELECTED DRAWING: Figure 34 |
