SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device having improved adhesion strength between a MEMS semiconductor wafer and a dicing tape with a die attach film; and provide the semiconductor device.SOLUTION: A semiconductor device manufacturing method comprises: a process of forming an electrode on a semiconductor wafer; and a process of forming a protection film having strong adhesion with an adhesive sheet, on a rear face side opposite to the side where the electrode is formed. Or, a semiconductor device comprises a semiconductor wafer, an electrode formed on the semiconductor wafer and a protection film having strong adhesion with an adhesive sheet, which is formed on a rear face side opposite to the side where the electrode is formed.SELECTED DRAWING: Figure 2