SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing apparatus which can reliably fix a constituent component of a semiconductor device in ultrasonic joining of the constituent components of the semiconductor device to achieve more stable joining state.SOLUTION: A semiconductor device manufacturing apparatus 1 including tabular components 11 and joining components 12 comprises: a tabular jig 11 on which a tabular component 21 is placed; a first fixture 12 and a second fixture 13 each of which has an inclined plane capable of contacting an upper edge of the tabular jig 11 on a width direction end and is fixed to the tabular jig 11 in vicinity to the width direction end; and an ultrasonic horn 14 capable of applying ultrasonic vibration to a tabular component 21 in a width direction of the tabular component 21 while depressing a joining component 23 toward the tabular component 21.SELECTED DRAWING: Figure 1