CHUCK STRUCTURE FOR TESTING A WAFER USING PROBE CARD

摘要

A chuck structure for testing a wafer by using a probe card comprises a chuck plate and a plurality of fluid channels. A wafer, which is tested by a probe card, is placed on an upper portion of the chuck plate. While the chuck plate is divided into a plurality of areas, each of the fluid channels is embedded in the chuck plate to correspond to each of the areas. The fluid channels are individually supplied with a fluid to cool or heat the wafer. The present invention provides a chuck structure capable of reducing a temperature variation depending on a position of a wafer.