| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition having high heat resistance and sufficiently suppressed defects such as warpage after curing and generating non-filled portions during molding.SOLUTION: There is provided a curing resin composition containing an epoxy resin, a curing agent and an inorganic filler, the epoxy resin contains a tri- or higher functional polyfunctional epoxy compound having the content of a monomer component of 80 mass% or more of the whole compound and the curing resin composition is solid at 25°C.SELECTED DRAWING: None |
