发明名称 THERMOSETTING RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting resin composition that has heat resistance and UV resistance in combination with high refractive index, has improved thermal shock resistance by virtue of a low elastic modulus and high elongation and is excellent in reliability as a sealing material for LED.SOLUTION: The thermosetting resin composition comprises (A), (B) and (C) as given below: (A) a thermosetting resin which is a reaction product of a silsesquioxane having an SiH group with an organopolysiloxane having two alkenyl groups and has an SiH group and an alkenyl group; (B) a linear organopolysiloxane compound having an SiH group each at both terminals; and (C) a Pt catalyst.SELECTED DRAWING: None
申请公布号 JP2016069485(A) 申请公布日期 2016.05.09
申请号 JP20140199201 申请日期 2014.09.29
申请人 JNC CORP 发明人 KITANI AYAKA;KAWABATA KIICHI;TAJIMA AKIO;MATSUO TAKASHI;WATANABE RYOKO;AYAMA KYOICHI
分类号 C08L83/14;C08G77/50;C08J5/24;C08K3/00;C08L83/05;H01L23/29;H01L23/31 主分类号 C08L83/14
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