发明名称 |
THERMOSETTING RESIN COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition that has heat resistance and UV resistance in combination with high refractive index, has improved thermal shock resistance by virtue of a low elastic modulus and high elongation and is excellent in reliability as a sealing material for LED.SOLUTION: The thermosetting resin composition comprises (A), (B) and (C) as given below: (A) a thermosetting resin which is a reaction product of a silsesquioxane having an SiH group with an organopolysiloxane having two alkenyl groups and has an SiH group and an alkenyl group; (B) a linear organopolysiloxane compound having an SiH group each at both terminals; and (C) a Pt catalyst.SELECTED DRAWING: None |
申请公布号 |
JP2016069485(A) |
申请公布日期 |
2016.05.09 |
申请号 |
JP20140199201 |
申请日期 |
2014.09.29 |
申请人 |
JNC CORP |
发明人 |
KITANI AYAKA;KAWABATA KIICHI;TAJIMA AKIO;MATSUO TAKASHI;WATANABE RYOKO;AYAMA KYOICHI |
分类号 |
C08L83/14;C08G77/50;C08J5/24;C08K3/00;C08L83/05;H01L23/29;H01L23/31 |
主分类号 |
C08L83/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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