发明名称 METHOD FOR MANUFACTURING FILM SUBSTRATE WITH TRANSPARENT ELECTRODE, AND FILM SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To solve such problems that upon forming a transparent electrode layer by electroplating on a film substrate where a resist layer having a resist opening is formed, more charges are supplied to both side portions in a width direction of the film substrate than in a center portion in the width direction and thereby, film thickness of the plating film varies.SOLUTION: In a method for manufacturing a film substrate with a transparent electrode, a film substrate (1) has a conductive layer (3) on at least one surface thereof, and a resist layer (4) having a resist opening (4a) formed therein for forming a transparent electrode, on the conductive layer (3). Upon forming a transparent electrode layer on the conductive layer (3) by electroplating, an electric current is applied to at least one conducting member (17) that can be electrically conducted to the conductive layer (3) through a plurality of sections in a width direction of the film substrate (1), so as to sequentially establish electric conduction to the plurality of sections, and the plurality of sections are intermittently electrically conducted by differentiating the conduction timing so as to always establish electric conduction between the conductive layer (3) and the conducting member (17) in at least one section.SELECTED DRAWING: Figure 2
申请公布号 JP2016069699(A) 申请公布日期 2016.05.09
申请号 JP20140201419 申请日期 2014.09.30
申请人 KANEKA CORP 发明人 TAKAHASHI YUJI;KUSHIZAKI TAKAYOSHI;TAMAI HITOSHI
分类号 C25D21/12;C25D5/56;C25D7/06;H01B5/14;H01B13/00 主分类号 C25D21/12
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