| 摘要 |
PROBLEM TO BE SOLVED: To bond a lower side metal member and an upper side metal member by melting solder with sound vibration with larger vibration energy than ultrasonic vibration.SOLUTION: A laminated bonding object member 14 consisting of a lower side metal member 15, an upper side metal member 16 and paste or plate-like solder 17 is sandwiched by a resonator 9 and a pedestal 13 to be compressed, the resonator 9 resonates with sound vibration transmitted from a vibrator 12, the solder 17 receives the compression and friction due to the vibration in the lateral direction indicated by an arrow X of the resonator 9, after the solder 17 is melted, generation of sound vibration of the vibrator 12 is stopped while the compression is maintained, and the lower side metal member 15 and the upper side metal member 16 are bonded to each other with solidification of the solder 17. Consequently, reduction in temperature due to sound vibration, reduction in residual stress due to heat are achieved, finish of the solder 17 after bonding becomes thin, thermal conduction efficiency between the lower side metal member 15 and the upper side metal member 16 is improved, and air bubbles are not generated in the solder 17.SELECTED DRAWING: Figure 1 |
