| 摘要 |
PROBLEM TO BE SOLVED: To provide a device, program and method for three-dimensional molding capable of molding a three-dimensionally molded material having enough strength and favorable dimensional accuracy.SOLUTION: A CPU of a three-dimensional molding device acquires first and second distances (S21), and flattens the three-dimensional molding powders to the thickness of the first distance on a first plane of a stage (S23). The CPU disposes the first plane and a second plane of a lid member parallel facing each other holding the three-dimensional molding powders in between, and moves the stage so that the first and second planes approach to a lamination direction by the second distance (S29). Further, after movement of the stage, the CPU brings to discharge a molding liquid from a head to harden at least a part of the three-dimensional molding powders (S35). The compression ratio when compressing the thickness of the three-dimensional molding powders from the first distance by the second distance is equal to the ratio of the porosity of the three-dimensional molding powders before compression to that after compression at a prescribed condition.SELECTED DRAWING: Figure 12 |
