| 摘要 |
A mounting head of a surface mounting device according to an aspect of the present invention supplies positive pressure, through a positive pressure supply path, to a nozzle adsorbing a component by negative pressure supplied through a negative pressure supply path such that the component can be mounted on a substrate. The mounting head of a surface mounting device comprises: a spool valve moving a spool from an initial position to a positive pressure switching position to perform switching to the positive pressure supply path; a control unit controlling the movement of the spool; and a landing detecting sensor detecting that the component adsorbed by the nozzle lands on the substrate. The control unit moves the spool to a preparation position between the initial position and the positive pressure switching position before the component adsorbed by the nozzle lands on the substrate, and when the landing detecting sensor detects the landing of the component, moves the spool from the preparation position to the positive pressure switching position. |
