| 摘要 |
PROBLEM TO BE SOLVED: To provide a power conversion device capable of increasing rigidity of a case, and reducing inductance parasitic to a DC bus bar.SOLUTION: A power conversion device comprises a structure 10 composed of a semiconductor module 2 and a cooler 3, a pressure member 4, a pair of DC bus bars 6 (6p, 6n), and a case 5. The pressure member 4 brings the semiconductor module 2 and the cooler 3 into close contact by pressurizing the structure 10. The structure 10, the pressure member 4, and the DC bus bars 6 are interposed between a pair of pressed wall parts 51 and 52 constituting the case 5. Welding pressure F of the pressure member 4 is applied to the pair of pressed wall parts 51 and 52. A reinforcement rib 53 connecting the pair of pressed wall parts 51 and 52 is formed in the case 5. The reinforcement rib 53 is provided between the pair of DC bus bars 6. An insulating layer 7 for insulating these is interposed between the DC bus bars 6 and the reinforcement rib 53.SELECTED DRAWING: Figure 1 |
