发明名称 COVER TAPE FOR PACKAGING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a cover tape for packaging an electronic component capable of suppressing generation of static electrification due to friction on a surface opposite to a surface of a sealant layer.SOLUTION: A cover tape 10 for packaging an electronic component includes: a base material layer 1; a sealant layer 2 disposed on one face side of the base material layer 1; and a conductivity polymer layer 3 disposed on the other face side of the base material layer 1. Friction static electrification voltage on a surface of the conductivity polymer layer 3 is -2200 to 2200 V.SELECTED DRAWING: Figure 2
申请公布号 JP2016068987(A) 申请公布日期 2016.05.09
申请号 JP20140198471 申请日期 2014.09.29
申请人 SUMITOMO BAKELITE CO LTD 发明人 MORIFUJI RYOSUKE
分类号 B65D85/86;B65D73/02 主分类号 B65D85/86
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