| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing pad capable of uniformly polishing the whole wafer.SOLUTION: The present invention relates to a polishing pad that is characterized in that: the polishing pad is provided with at least (A) a surface polishing layer, (B) an adhesive layer, and (C) a cushion layer; the layers are laminated in the order of (A)/(B)/(C); the compression rate of (A) the surface polishing layer is 0.3-3.0% inclusive; and the relationship wherein the compression rate of (C) the cushion layer is higher than the compression rate of (A) the surface polishing layer is satisfied.SELECTED DRAWING: None |
