发明名称 THERMOELECTRIC CONVERSION MODULE
摘要 PROBLEM TO BE SOLVED: To provide a thermoelectric conversion module applied in various field for converting heat into electric power or electric power into heat capable of preventing damages due to thermal expansion.SOLUTION: A first metal substrate 10 and a second metal substrate 20 are disposed at both sides of plural thermoelectric elements 5. The first metal substrate 10 is constituted of plural divided substrates 10A. The divided substrates 10A are disposed being interposed by a gap 50 therebetween.SELECTED DRAWING: Figure 1
申请公布号 JP2016072579(A) 申请公布日期 2016.05.09
申请号 JP20140203667 申请日期 2014.10.02
申请人 PANASONIC IP MANAGEMENT CORP 发明人 OKUZONO EIJI;YUGAWA NORIAKI;KANO HISASHI
分类号 H01L35/32;H02N11/00 主分类号 H01L35/32
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