发明名称 |
THERMOELECTRIC CONVERSION MODULE |
摘要 |
PROBLEM TO BE SOLVED: To provide a thermoelectric conversion module applied in various field for converting heat into electric power or electric power into heat capable of preventing damages due to thermal expansion.SOLUTION: A first metal substrate 10 and a second metal substrate 20 are disposed at both sides of plural thermoelectric elements 5. The first metal substrate 10 is constituted of plural divided substrates 10A. The divided substrates 10A are disposed being interposed by a gap 50 therebetween.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016072579(A) |
申请公布日期 |
2016.05.09 |
申请号 |
JP20140203667 |
申请日期 |
2014.10.02 |
申请人 |
PANASONIC IP MANAGEMENT CORP |
发明人 |
OKUZONO EIJI;YUGAWA NORIAKI;KANO HISASHI |
分类号 |
H01L35/32;H02N11/00 |
主分类号 |
H01L35/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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