| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition capable of enhancing adhesiveness between a cured object after curing and a conductor part, and capable of reducing a residual amount of smear in via processing.SOLUTION: A resin composition according to the present invention comprises at least one kind of epoxy resin and at least two kinds of curing agents. At least the two kinds of curing agents include an active ester curing agent. A ratio of a total wt.% of nitrogen atoms included in 100 wt.% of whole epoxy resin in the resin composition, to a total wt.% of nitrogen atoms included in 100 wt.% of whole curing agents in the resin composition, is equal to or more than 1/3, and equal to or less than 1.SELECTED DRAWING: Figure 1 |
