发明名称 HOLLOW RESIN PARTICLE AND PRODUCTION PROCESS THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a hollow resin particle of small grain size that has less pin holes and that has less collapses.SOLUTION: The problem is solved by a hollow resin particle comprising a hollow surrounded by a shell, and in which, characterized, said shell comprises a region composed of a non-crosslinked polymer on a side in contact with the hollow, does not comprise a pinhole having a diameter larger than 5 nm, and said hollow resin particle has an average diameter of 0.05 μm to 1 μm.SELECTED DRAWING: Figure 1
申请公布号 JP2016068037(A) 申请公布日期 2016.05.09
申请号 JP20140201200 申请日期 2014.09.30
申请人 SEKISUI PLASTICS CO LTD 发明人 KIYOHARA AYUMI;KATAYAMA YUGO;NISHIUMI KENGO
分类号 B01J13/18 主分类号 B01J13/18
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