ELECTRICALLY RECONFIGURABLE INTERPOSER WITH BUILT-IN RESISTIVE MEMORY

摘要

An integrated interposer may include a substrate and a resistive-type non-volatile memory (NVM) array(s). The integrated interposer may also include a contact layer on a first surface of the substrate. The contact layer may include interconnections configured to couple the resistive-type NVM array(s) to a die(s). The resistive -type NVM array(s) may be partially embedded within the contact layer of the integrated interposer.