HEAT-DISSIPATING STRUCTURE

摘要

The present invention provides a heat-dissipating structure having high heat dissipation properties. This heat-dissipating structure includes: a heat sink (2) having a base section (6) and a plurality of heat-dissipating fins (7A, 7B) provided in an upright manner on a first surface (6a) of the base section (6); a first heat-generating component (3) for contacting one or more of the heat-dissipating fins (7B) among the plurality of heat-dissipating fins (7A, 7B), and provided on the first surface (6a) side of the base section (6); and a circuit substrate (4) electrically connected to the first heat-generating component (3) and joined to a second surface (6b) of the base section (6) on the opposite side thereof from the first surface (6a).