发明名称 |
PHOTONIC INTERPOSER WITH WAFER BONDED MICROLENSES |
摘要 |
A silicon photonic (SiPh) packaging assembly includes a SiPh interposer and a wafer. The SiPh interposer has one or more optical gratings disposed thereon to couple an optical signal traversing the wafer. The wafer is bonded to the interposer, with the wafer including one or more microlenses, each microlens aligned with a respective optical grating and designed to direct the optical signal traversing the wafer at a desired angle. |
申请公布号 |
WO2016068876(A1) |
申请公布日期 |
2016.05.06 |
申请号 |
WO2014US62619 |
申请日期 |
2014.10.28 |
申请人 |
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP |
发明人 |
MATHAI, SAGI VARGHESE;TAN, MICHAEL RENNE TY;SORIN, WAYNE VICTOR |
分类号 |
H01L23/48;H01L23/12 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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