发明名称 COMPOSITE DIAMOND BODY AND COMPOSITE DIAMOND TOOL
摘要 This composite diamond body (10) includes a diamond parent material (11) and a stable layer (12) that is disposed atop the diamond parent material (11). Herein, the stable layer (12) can have a thickness of at least 0.001 µm but less than 10 µm, and can include a plurality of layers. This composite diamond tool (1) includes the composite diamond body (10). This makes it possible to provide a composite diamond body and composite diamond tool having high abrasion resistance and being capable of accommodating mirror surface planarization processing of a workpiece that reacts with a diamond and causes abrasion of said diamond.
申请公布号 WO2016068231(A1) 申请公布日期 2016.05.06
申请号 WO2015JP80537 申请日期 2015.10.29
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD.;SUMITOMO ELECTRIC HARDMETAL CORP. 发明人 NISHIBAYASHI, YOSHIKI;UEDA, AKIHIKO;KOBAYASHI, YUTAKA
分类号 B23B27/20;B23B27/14;C23C14/06;C23C14/14;C23C16/06;C23C16/27;C23C16/32;C30B29/04 主分类号 B23B27/20
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