| 摘要 |
Deposition table (1) for the inspection and/or orientation of electronic components (B) prior to populating a circuit board with said components, on which table the components, which are initially held at a nozzle end (7) by means of negative pressure, are deposited after release by the nozzle end, wherein the table (1) has a transparent deposition plate (2), preferably a glass plate, and a delimiting border (5, 6p, 6z, 12) is provided which prevents displacement of a component (B) temporarily deposited on the deposition plate by the air flowing out of the nozzle, and an optical inspection device is arranged under the deposition table (6u) and an optical inspection device is arranged above the deposition table (6o). |
