发明名称 |
MICROPHONE PACKAGE WITH MOLDED SPACER |
摘要 |
A microelectromechanical system (MEMS) microphone package including a MEMS microphone die configured to sense acoustic pressure and to generate a signal based on the acoustic pressure. An application specific integrated circuit (ASIC) electrically connects to the MEMS microphone die. The MEMS microphone package includes a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms side walls of the MEMS microphone package and is adapted to route electrical connections from the MEMS microphone die and the ASIC to the substrate. |
申请公布号 |
WO2016069691(A1) |
申请公布日期 |
2016.05.06 |
申请号 |
WO2015US57712 |
申请日期 |
2015.10.28 |
申请人 |
ROBERT BOSCH GMBH |
发明人 |
SALMON, JAY, SCOTT;SAXENA, KULDEEP |
分类号 |
H04R19/00;B81B7/00 |
主分类号 |
H04R19/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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