PHOTONIC INTEGRATION BY FLIP-CHIP BONDING AND SPOT-SIZE CONVERSION

摘要

Two or more monolithic or heterogeneously integrated substrates are attached to each other and optically edge-coupled using spot-size converters. Spot-size converters are placed between planar optical waveguides and cleaved or etched facets in each substrate. The facets are provide optical edge coupling and the spot-size converters are used to adjust at least the size, shape, and divergence of the optical beams entering or exiting the optical waveguides as to improve the optical coupling between the substrates. In addition to spot-size converters, filtering and other light adjusting elements may be placed between the substrates. Integrated lasers, semiconductor optical amplifiers, and photonic integrated circuits can be provided with complementary metal-oxide semiconductor (CMOS)-compatible silicon (Si) photonic substrates, which can also contain integrated electronics.