A wide array printhead module includes a plurality of printhead die. Each of the printhead die includes a number of sensors to measure properties of a number of elements associated with the printhead die. The wide array printhead module further includes an application specific integrated circuit (ASIC) to command and control each of the printhead die. The ASIC is located off any of the printhead die.
申请公布号
WO2016068900(A1)
申请公布日期
2016.05.06
申请号
WO2014US62831
申请日期
2014.10.29
申请人
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
发明人
ANDERSON, DARYL E.;CORRIGAN III, GEORGE H.;LINN, SCOTT A.