METHOD OF ABSORBING HEAT WITH SERIES-CONNECTED HEAT SINK MODULES

摘要

A method of cooling multiple processors of an electronic device can employ a two-phase cooling system with series-connected heat sink modules. A flow of dielectric single-phase liquid coolant can be provided to a first heat sink module on a first processor. Within the first heat sink module, a first amount of heat can be transferred from the first processor to the liquid coolant resulting in vaporization of a first portion of liquid coolant, thereby changing the flow to two-phase bubbly flow as heat is absorbed across the heat of vaporization of the coolant. The two-phase bubbly flow can then pass from the first heat sink module to a second heat sink module mounted on a second processor. Within the second module, heat transfer from the second processor to the coolant can result in vaporization of a second portion of liquid coolant, thereby increasing vapor quality of the two-phase bubbly flow.