BONDING COMPOSITION

摘要

Provided is a bonding composition with which high bonding strength can be obtained by bonding at a comparatively low temperature and a good bonded body can be obtained even in the event that the time after the application of the bonding composition to a surface to be bonded until a step of bonding using heat is long. This bonding composition, in which inorganic particles are used as a main component and an organic component is used as an auxiliary component, is characterized in that the weight reduction when the bonding composition is left for 6 hours in a room temperature atmosphere is 1.5 mass% or less, and the weight reduction when the bonding composition is heated in the atmosphere from room temperature to 100 °C at a heating rate of 10 °C/minute is 3.0 mass% or less.