发明名称 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
摘要 The present invention provides a semiconductor structure, including a substrate, having a fin structure disposed thereon, a gate structure, crossing over parts of the fin structure. The top surface of the fin structure which is covered by the gate structure is defined as a first top surface, and the top surface of the fin structure which is not covered by the gate structure is defined as a second top surface. The first top surface is higher than the second top surface, and a spacer covers the sidewalls of the gate structure. The spacer includes an inner spacer and an outer spacer, and the outer pacer further contacts the second top surface of the fin structure directly.
申请公布号 US2016126334(A1) 申请公布日期 2016.05.05
申请号 US201414562782 申请日期 2014.12.08
申请人 UNITED MICROELECTRONICS CORP. 发明人 Li Jhen-Cyuan;Lu Shui-Yen;Wu Yen-Liang
分类号 H01L29/66;H01L29/78 主分类号 H01L29/66
代理机构 代理人
主权项 1. A semiconductor structure, comprising: a substrate, having a fin structure disposed thereon; a gate structure, crossing over parts of the fin structure, wherein a top surface of the fin structure which is covered by the gate structure is defined as a first top surface, and a top surface of the fin structure which is not covered by the gate structure is defined as a second top surface, the first top surface being higher than the second top surface; and a spacer, covering sidewalls of the gate structure, wherein the spacer includes an inner spacer and an outer spacer, and the outer spacer contacts the second top surface of the fin structure directly.
地址 Hsin-Chu City TW