发明名称 |
PATTERN FORMATION METHODS |
摘要 |
Methods of forming an electronic device, comprise: (a) providing a semiconductor substrate comprising one or more layers to be patterned; (b) forming a photoresist layer over the one or more layers to be patterned, wherein the photoresist layer is formed from a composition that comprises: a matrix polymer comprising a unit having an acid labile group; a photoacid generator; and an organic solvent; (c) coating a photoresist overcoat composition over the photoresist layer, wherein the overcoat composition comprises: a matrix polymer; an additive polymer; a basic quencher; and an organic solvent; wherein the additive polymer has a lower surface energy than a surface energy of the matrix polymer, and wherein the additive polymer is present in the overcoat composition in an amount of from 1 to 20 wt % based on total solids of the overcoat composition; (d) exposing the photoresist layer to activating radiation; (e) heating the substrate in a post-exposure bake process; and (f) developing the exposed film with an organic solvent developer. The methods have particular applicability in the semiconductor manufacturing industry. |
申请公布号 |
US2016124309(A1) |
申请公布日期 |
2016.05.05 |
申请号 |
US201514927354 |
申请日期 |
2015.10.29 |
申请人 |
Rohm and Haas Electronic Materials LLC |
发明人 |
LEE Choong-Bong;CAPORALE Stefan J.;DeSISTO Jason A.;PARK Jong Keun;LIU Cong;XU Cheng-Bai;ANDES Cecily |
分类号 |
G03F7/20;G03F7/38;G03F7/32;G03F7/16 |
主分类号 |
G03F7/20 |
代理机构 |
|
代理人 |
|
主权项 |
1. A pattern formation method, comprising:
(a) providing a semiconductor substrate comprising one or more layers to be patterned; (b) forming a photoresist layer over the one or more layers to be patterned, wherein the photoresist layer is formed from a composition that comprises: a matrix polymer comprising a unit having an acid labile group; a photoacid generator; and an organic solvent; (c) coating a photoresist overcoat composition over the photoresist layer, wherein the overcoat composition comprises: a matrix polymer; an additive polymer; a basic quencher; and an organic solvent; wherein the additive polymer has a lower surface energy than a surface energy of the matrix polymer, and wherein the additive polymer is present in the overcoat composition in an amount of from 1 to 20 wt % based on total solids of the overcoat composition; (d) exposing the photoresist layer to activating radiation; (e) heating the substrate in a post-exposure bake process; and (f) developing the exposed film with an organic solvent developer. |
地址 |
Marlborough MA US |