| 发明名称 |
Method for Attaching a Semiconductor Die to a Carrier |
| 摘要 |
A method for fabricating an electronic device includes providing a first semiconductor chip and a second semiconductor chip. The first semiconductor chip has a first semiconductor die and a first solder interconnect layer applied to a main face of the first semiconductor die. The second semiconductor chip has a second semiconductor die, an insulating layer applied to a main face of the second semiconductor die, and a second solder interconnect layer applied to the insulating layer. The method further includes attaching the first semiconductor chip with the first solder interconnect layer to a first carrier and attaching the second semiconductor chip with the second solder interconnect layer to a second carrier. |
| 申请公布号 |
US2016126227(A1) |
申请公布日期 |
2016.05.05 |
| 申请号 |
US201514926892 |
申请日期 |
2015.10.29 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Bauer Michael;Heitzer Ludwig;Stuempfl Christian |
| 分类号 |
H01L25/16;H01L21/78;H01L21/02;H01L25/00;H01L23/00 |
主分类号 |
H01L25/16 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for fabricating an electronic device, the method comprising:
providing a first semiconductor chip, the first semiconductor chip comprising a first semiconductor die and a first solder interconnect layer applied to a main face of the first semiconductor die; providing a second semiconductor chip, the second semiconductor chip comprising a second semiconductor die, an insulating layer applied to a main face of the second semiconductor die, and a second solder interconnect layer applied to the insulating layer; and attaching the first semiconductor chip with the first solder interconnect layer to a first carrier and attaching the second semiconductor chip with the second solder interconnect layer to a second carrier. |
| 地址 |
Neubiberg DE |
