SEMICONDUCTOR PACKAGE WITH ADHESIVE MATERIAL PRE-PRINTED ON THE LEAD FRAME AND CHIP, AND ITS MANUFACTURING METHOD

摘要

This invention discloses a semiconductor package with adhesive material pre-printed on the lead frame and chip, and the manufacturing method. The adhesive material is applied onto the chip carrier and the pin of the lead frame and also on the front electrode of the semiconductor chip via pre-printing. The back of the semiconductor chip is adhered on the chip carrier, and the front electrode of the semiconductor chip and the pin are connected respectively with a metal connector. The size, shape and thickness of the adhesive material are applied according to different application requirements according to size and shapes of the contact zone of the semiconductor chip and the metal connector. Particularly, the adhesive zones are formed by pre-printing the adhesive material thus significantly enhance the quality and performance of semiconductor products, and improves the productivity.

主权项

1. A method for manufacturing a semiconductor package comprising:
a) printing a conductive adhesive material on a plurality of adhesive zones on a lead frame at a room temperature and simultaneously printing the conductive adhesive material on a plurality of adhesive zones on chip carrier of the lead frame at a room temperature followed by curing the adhesive material; b) printing a conductive adhesive layer on a plurality of electrodes disposed on a top surface of a semiconductor chip followed by mounting a backside opposite the top surface of the semiconductor chip onto the leadframe carrier; c) applying a heating process for adhering the backside of the semiconductor chip onto the adhesive zones of the chip carrier of the lead frame and simultaneously forming metal connectors for interconnecting a plurality of pins disposed on the leadframe to the electrodes disposed on a top surface of the semiconductor chip; and d) molding the leadframe and the semiconductor chip into a plastic package.