CIRCUIT SUBSTRATE AND SEMICONDUCTOR PACKAGE STRUCTURE

摘要

The invention provides a circuit substrate and a semiconductor package structure. The circuit substrate includes a core substrate having a chip-side surface and a bump-side surface opposite to the chip-side surface. A first through via plug passes through the core substrate. A first conductive line pattern and a second conductive line pattern adjacent to the first conductive line are disposed on the chip-side surface. A pad is disposed on the bump-side surface. The first through via plug is in direct contact with and partially overlapping the first conductive line pattern and the pad. The first conductive line pattern, the second conductive line pattern and the first through via plug are configured to transmit voltage supplies of the same type.

主权项

1. A circuit substrate for a chip bonding thereon, comprising:
a core substrate having a chip-side surface and a bump-side surface opposite to the chip-side surface; a first through via plug passing through the core substrate; a first conductive line pattern and a second conductive line pattern adjacent to the first conductive line disposed on the chip-side surface; and a pad disposed on the bump-side surface, wherein the first through via plug is in direct contact with and partially overlapping the first conductive line pattern and the pad, and wherein the first conductive line pattern, the second conductive line pattern and the first through via plug are configured to transmit voltage supplies of the same type.