| 发明名称 |
CIRCUIT BOARD WITH CONSTRAINED SOLDER INTERCONNECT PADS |
| 摘要 |
Various circuit boards and methods of manufacturing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a solder mask on a circuit board with a first opening that has a sidewall. A solder interconnect pad is formed in the first opening. The sidewall sets the lateral extent of the solder interconnect pad. |
| 申请公布号 |
US2016126171(A1) |
申请公布日期 |
2016.05.05 |
| 申请号 |
US201414529859 |
申请日期 |
2014.10.31 |
| 申请人 |
Topacio Roden;Leung Andrew K.W. |
发明人 |
Topacio Roden;Leung Andrew K.W. |
| 分类号 |
H01L23/498;H01L21/48 |
主分类号 |
H01L23/498 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing, comprising:
forming a solder mask on a circuit board with a first opening having a sidewall; and forming a solder interconnect pad in the first opening, the sidewall setting the lateral extent of the solder interconnect pad. |
| 地址 |
Markham CA |
