Method for Processing a Semiconductor Wafer Using a Thin Edge Carrier Ring

摘要

A method for processing a semiconductor wafer in a PECVD deposition chamber with a circular pedestal and a recessed portion formed around the outer top surface of the pedestal. The method may include using a circular wafer carrier ring with a recessed portion.

主权项

1. A method, comprising:
placing a carrier ring inside a deposition chamber, the carrier ring including a central region, a second region surrounding the central region, and an outer region surrounding the second region and recessing from a top surface of the second region; placing a semiconductor wafer into a receptacle defined by the central region and the second region of the carrier ring; releasing a deposition material in the deposition chamber; and retaining a portion of the deposition material by the outer region of the carrier ring.