| 摘要 |
A silicone resin comprising constitutional units represented by formula (1) and having a Mw of 3,000-500,000 contains 10-50 wt % of (A-1) a first silicone resin having a silicone content of 10-40 wt % and (A-2) a second silicone resin having a silicone content of 50-80 wt %. A resin composition comprising the silicone resin can be formed in film form, and it possesses satisfactory covering or encapsulating performance to large size/thin wafers. The resin composition or resin film ensures satisfactory adhesion, low warpage, and wafer protection. The resin film is useful in wafer-level packages.; |
| 主权项 |
1. A silicone resin comprising constitutional units represented by the compositional formula (1) and having a weight average molecular weight of 3,000 to 500,000, containing (A-1) a first silicone resin having a silicone content of 10 to 40% by weight of the first silicone resin, and (A-2) a second silicone resin having a silicone content of 50 to 80% by weight of the second silicone resin, the weight content of first silicone resin (A-1) being 10 to 50% by weight of the total weight of the silicone resin, wherein R1 to R4 are each independently a monovalent C1-C8 hydrocarbon group, excluding that R3 and R4 are methyl at the same time, m and n each are an integer of 0 to 300, a and b are positive numbers, a+b=1, X is a divalent linking group having the general formula (2) or (3), c indicative of moles of the group of formula (2) and d indicative of moles of the group of formula (3) are in the range of 0/1≦d/c≦1/1, wherein V is a divalent organic group selected from the following: p is 0 or 1, R5 is hydrogen or methyl, f is an integer of 0 to 7, R6 and R7 are each independently C1-C4 alkyl or alkoxy, h is 0, 1 or 2, wherein R3 and R4 are each independently a monovalent C1-C8 hydrocarbon group, excluding that R3 and R4 are methyl at the same time, q and r each are an integer of 0 to 300, R8 is hydrogen or methyl, and k is an integer of 0 to 7. |
